高性价比的专业一站式供应商和服务商
产品特色
卷对卷双面光刻
Volume-to-volume double-sided lithography
一机多用,单面,双面,内层,冲孔板作业
One machine multi-purpose, single, double, inner layer, punching plate operation
高解析度 LDI 光源,上下框可抽出式清洁方式
High-resolution LDI light source.The upper and lower boxes can be drawn out of the cleaning way
标准规格 STANDARD SPECIFICATIONS
光路解析能力 | 25/25um | Optical path resolutioncapability | 25/25um |
线宽/线距样品生产能力 | 40um/40um | Line width/pitch sample production capacity | 40um/40um |
线宽/线距量产生产能力 | 50um/50um | Line width/line spacing capacity | 50um/50um |
线宽公差 | ±5um | Tolerance of line width | ±5um |
对准方式 | MARK/靠边/孔 | Alignment | Mark/Edge/hole |
外层对位精度 | ±10μm | Outer alignment accuracy | ±10μm |
层间对位精度 | ±5μm | Interlayer alignment accuracy | ±5μm |
光源类型 | 激光 | Type of light source | Lasers |
光源寿命 | ≥10000小时 | Light source life | ≥10,000 hours |
资料分辨率 | 1.2um | Data resolution | 1.2um |
曝光方式 | 双面曝光 | Exposure mode | Double exposure |
输送方向 | 左放右收/右放左收 | Direction of transportation | Left to right/right to left |
曝光长度 | max:610 | Exposure length | max:610 |
光路数量 | ≥6个 | Number of light paths | ≥6个 |
光路一次曝光宽度 | ≥30mm | Light path one exposure width | ≥30mm |
能量均匀性 | ≥95% | Energy uniformity | ≥95% |
靶点识别 | 通孔/PAD/银点/mark/半通孔 | Target recognition | Through Hole/PAD/silver dot/mark/semi-through hole |
拼接误差 | ±3um | Splicing error | ±3um |
卷材宽度 | max:500 mm | Width of coil | max:500 mm |
卷材类型 | 铜及合金/钢及合金/钛 | Coil type | Copper and alloy/steel and alloy/titanium |
卷材重量 | ≥350kg | Weight of coil | ≥350kg |
卷材外径尺寸 mm | ≤800 | Coil outer diameter size mm | ≤800 |
卡盘内直径 mm | 400 | Diameter of Chuck mm | 400 |
卷材厚度 mm | 0.02-0.4mm | Coil thickness mm | 0.02-0.4mm |
输送速度 m/min | ≥1.7 | Conveying speed m/min | ≥1.7 |
产能 平米/天 | >646平米 | Capacity, square metre per day | >646平米 |
EPC精度 mm | ±0.5mm | EPC accuracy mm | ±0.5mm |
具体参数以实物为准 |
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